Firmware Backup Tecno LE6-GL-LINK 2024

Ketua Teknisi HP (Official)

FIRMWARE TECNO

Firmware Backup Tecno LE6-GL.File dibackup lansung dari smartphonenya dalam kondisi normal manakala ini untuk perbaikan masalah software seperti mati total,hang logo,bootloop,sinyal dan seterusnya...bisa mengunakan file ini

Backup Sebelum Melakukan Pengerjaan Apapun

LOG

Info System

FINGERPRINT : TECNO/LE6-GL/TECNO-LE6:11/RP1A.200720.011/211014V173:user/release-keys

Manufacturer : ro.TECNO-LE6

BUILD ID : RP1A.200720.011

SECURITY PATCH  : 2021-09-05

CPU ABI : arm64-v8a

CPU ABILIST : arm64-v8a,armeabi-v7a,armeabi

CPU ABILIST32 : armeabi-v7a,armeabi

CPU ABILIST64 : arm64-v8a

LOCALE : en-US

Build Description : vnd_le6_h6222-user 11 RP1A.200720.011 174514 release-keys

Platform : mt6765

BUILD : TECNO/LE6-GL/TECNO-LE6:11/RP1A.200720.011/211014V173:user/release-keys

ODM NAME : LE6-GL

SUPPORT PRELOADER

EMIInfo{0x0}:150100445036444142:0x15:Samsung:DP6DAB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):4.00GB

EMIInfo{0x1}:150100445836384d42:0x15:Samsung:DX68MB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):3.00GB

EMIInfo{0x2}:90014a68433861503e:0x90:SkHynix:hC8aP>:0x4a:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):4.00GB

EMIInfo{0x3}:90014a68423861503e:0x90:SkHynix:hB8aP>:0x4a:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):3.00GB

EMIInfo{0x4}:150100335636434d42:0x15:Samsung:3V6CMB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):6.00GB

EMIInfo{0x5}:150100335636434242:0x15:Samsung:3V6CBB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):6.00GB

EMIInfo{0x6}:150100445036444242:0x15:Samsung:DP6DBB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):4.00GB

File backup scatterr_tecno-LE6 GL.Silahkan flash menggunakan UFS Tool maupun tool lainyaSelamat mencoba dan semoga sukses