File Dump eMMC iNFINIX HOT 9

Ketua Teknisi HP (Official)

File eMMC Infinix HOT 9

File Dump eMMC iNFINIX HOT 9.DIbeberapa situasi file dump ini dibutuhkan saat proses pergantian ic emmc pada smartphone yang menggunakan chip Mediatek..langsung saja diunduh jika memang diperlukan

Log Ufi Box:

VCC: 3.3 V, VCCQ: 3.0 V

Bus: 8 bit (HS SDR 52MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

Card/BGA: BGA (Discrete embedded) - High density MMC

Manufacturer ID: 0x15 (Samsung)

Product name: DP6DAB (0x445036444142), rev: 0x03, serial number: 0x76CDCE16

Manufacturing date: May 2020

CID: 15010044 50364441 420376CD CE16571C

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

Boot1: 4 MiB

Boot2: 4 MiB

RPMB: 16 MiB [Authentication Key not yet programmed]

User area: 58.24 GiB(62,537,072,640 bytes)

Cache size: 64 MiB

Hardware reset function: 1

Partition configuration: 0x48

Boot acknowledge is sent during the boot operation

Boot partition 1 is enabled for boot

Partitioning support: 0x07

Device support partitioning feature

Device can have enhanced technological features

Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x02

Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)

Boot area write protection: 0x00

crypto state: encrypted?

eMMC selected: [SAMSUNG] KMDP6001DA-B425/64GB+LPDDR4X 32Gb  (BGA254)