Service emmc & Repair guide
DEVICE/INFO
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0x33DBE9A8
Manufacturing date: Jan 2016
CID: 90014A48 38473165 050733DB E9A813EA
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID ROM info:
platform: msm8610, cpu abi: armeabi-v7a
manufacturer: asus
board: MSM8610, name: WW_Phone
brand: asus, model: ASUS_X014D
build id: LMY47V, version: 5.1.1 Lollipop (LMY47V.WW_Phone-12.3.1.1.PCBA10-20160107)
build description: WW_Phone-eng 5.1.1 LMY47V 12.3.1.1.PCBA10-20160107 test-keys
Selected: [HYNIX] eNAND H9TQ64A8GTMCUR-KUM/8GB+LPDDR3 8Gb (BGA221)
LOG EMMC ASUS ZENFONE GO |
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0x33DBE9A8
Manufacturing date: Jan 2016
CID: 90014A48 38473165 050733DB E9A813EA
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
platform: msm8610, cpu abi: armeabi-v7a
manufacturer: asus
board: MSM8610, name: WW_Phone
brand: asus, model: ASUS_X014D
build id: LMY47V, version: 5.1.1 Lollipop (LMY47V.WW_Phone-12.3.1.1.PCBA10-20160107)
build description: WW_Phone-eng 5.1.1 LMY47V 12.3.1.1.PCBA10-20160107 test-keys
Selected: [HYNIX] eNAND H9TQ64A8GTMCUR-KUM/8GB+LPDDR3 8Gb (BGA221)
- Log ini admin ambil dari UFIBOX Dengan adanya ini mudah-mudahan bisa membantu kawan-kawan yang ingin melakukan pergantian ic emmc/emcp bisa menjadi lebih mudah.Bantu share jika artikel ini bermanfaat Terima Kasih.
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